R&D Engineer Adv Tech Dev

Work with business unit marketing and IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new advanced silicon node products (5nm, 3nm, 2nm and beyond) Work with IC design, system design, package SI/PI & thermal engineering teams to design custom packages Ensure designed packages meet CPI, SI/PI, and stringent thermal requirements (1000sW+) of advanced node cutting edge silicon products Research, develop, and productize new materials such as TIM, build-up-film, underfill etc. in support advanced node silicon (5nm & 3/2nm) POR definition Manage IC packaging activity from concept through development, qualification and high volume production Be a specialist and able to define assembly BOM, process, troubleshoot, support on packaging issues on new advanced technology Implement, fine-tune, and productize newly developed technologies into HVM Create package design documentation and assembly instructions Work close with QA and customers to resolve quality issues Interface with packaging assembly and substrate suppliers for new product bring-up, qualification and production ramp Interface with other operations functional groups such as product engineering, foundry, test, and QA Participate in package technology development and/or other business productivity projects which have broad team impact (e.g. assembly process enhancement, new TIM material development etc.) Interface with tier #1 external customers for custom ASIC programs or as needed for development support, quality and/or other issue resolution Support NPI bring-up, pkg qual, and sustain support in production + multi-source activities for capacity, cost, & manufacturing flexibility needs